| 학회 |
한국고분자학회 |
| 학술대회 |
2017년 봄 (04/05 ~ 04/07, 대전컨벤션센터) |
| 권호 |
42권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Copper migration suppresion in die attach film using chelating material |
| 초록 |
Iminodiacetic acid (IDA) has been known that copper exhibits very high sorption affinity. This work studied the copper electrochemical migration (ECM) suppression effect by using IDA as additive in bisphenol-A type epoxy/ phenol type hardner system through metal-ligand chelation. Furthermore excess diaminopyridine (DAP) that has amine group to capture copper ion was preformed whether it has similar effect like IDA or not. Epoxy/hardner system containing IDA was cured, it was immersed in CuSO4·5H2O solution during several hours. ICP analysis was performed to know copper ion sorption. Finially the accelerated copper migration test was performed under JEDEC moisture sensitivity level 1 (85°C/85% RH). |
| 저자 |
이석환, 강석우, 서흔영, 윤호규
|
| 소속 |
고려대 |
| 키워드 |
Copper migration; die attach film; IDA
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| E-Mail |
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