| 초록 |
Many efforts have been made to improve the mechanical properties of epoxy-based electronic packaging materials at low temperature. glass transition temperature (Tg), coefficient of thermal expansion (CTE), adhesion strength and water absoption also are key factors to be considered in electgronic by introducing nanao-sized core shell rubber (CSR) particles (about 150-200nm in diameter) into epoxy systems have been attempted to abtain the improved mechanical properties. Various methoeds to disperse CSR particles into epoxy systems were introduced. By incorporating CSR particles into epoxy systems, adhesion strength (T-peel strength)and impact peel strength at low temperature(-40℃)significantly inceased shile high Tg of epoxy systems maintained almost constant. Furthermore, amine terminated-epoxy was synthesized and used to improve wetting properties at the substrate surface.CTE of CSR/epoxy systems, measured by thermomechanical analysys (TMA), was slightly affected by the CSR contents in epoxy systems in this study. |
