| 학회 |
한국고분자학회 |
| 학술대회 |
2010년 봄 (04/08 ~ 04/09, 대전컨벤션센터) |
| 권호 |
35권 1호 |
| 발표분야 |
고분자 구조 및 물성 |
| 제목 |
The study on the optimization of the curing condition of low-CTE epoxy system. |
| 초록 |
Epoxy has been extensively used as semiconductor package materials such as IC substrate, underfill agent, EMC(epoxy molding compound), die bond, and so on. However, the CTE-mismatch between epoxy and inorganic (silicon chip) compound leads to the serious problems in packaging: Interface cracking and wrapage of substrate are frequently observed. Therefore the CTE value of epoxy material is required to be reduced up to silicon-compatible level (＜ 5ppm/℃). In this work, we prepared the epoxy composites with various curing agents in order to design the optimum epoxy cured systems. The CTE, glass transition temperature (Tg) and hardness of epoxy cured composites were evaluated by DSC, TMA and AFM, respectively. And the effect of curing agents of each epoxy systems on curing condition and thermal properties were discussed. |
| 저자 |
김현아1, 탁상용2, 오창호2, 김환건3, 김주령1, 정민재1, 강소영1, 신승한1, 전현애1
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| 소속 |
1한국생산기술(연), 2한양대, 3서경대 |
| 키워드 |
curing agent; epoxy composite; thermal property; CTE; Tg; AFM
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| E-Mail |
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