| 학회 |
한국고분자학회 |
| 학술대회 |
2011년 봄 (04/07 ~ 04/08, 대전컨벤션센터) |
| 권호 |
36권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
The preparation of the novel epoxy composites with the enhanced thermal properties |
| 초록 |
The demand for the semiconductor substrate with low coefficient of thermal expansion has been ever increasing with the advance of Information technology. However the application of the substrate is still limited by the high coefficient of thermal expansion (CTE) of epoxy systems. In this work, it has been attempted to improve the thermal properties of the epoxy-filler composite. The new epoxy resin was synthesized and cured with various curing agents. The CTE and Tg of epoxy-silica composites were characterized using the TMA. And the effects of silica filler on thermal properties of epoxy systems were discussed. |
| 저자 |
정민재, 전현애, 박수진, 김윤주, 탁상용, 신승한
|
| 소속 |
한국생산기술(연) |
| 키워드 |
epoxy; CTE; Tg; curing agent; composite
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| E-Mail |
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