| 초록 |
Biphenyl type epoxy is cured with phenol type hardeners for suppressing Cu migration. Biphenyl/phenol combination shows lower free volume than DGEBA/TH-432 system, the former absorbs moisture much lower than the latter because of the water affinity of amine hardener, TH-432. Since the mesogen groups in biphenyl type epoxy partially form the quasi-crystalline structure via π-π stacking of aromatic rings. The free volume can be decrease by increasing the content of the quasi-crystalline structure and the coupling agent treated silica, thus the biphenyl/phenol system shows low moisture absorption. The phenol-cured biphenyl type epoxy composites coated on PI film to confirm adhesion strength and pencil hardness. The morphology of quasi-crystalline structure in the biphenyl epoxy can be appraised by using electron diffraction, FETEM. The accelarated Cu migration test reveals that the migation is suppressed by the phenol-cured biphenyl type epoxy/silica composites for more than 500 hrs. |
