| 초록 |
Polyimides have found many applications as high temperature insulators and dielectrics, adhesives and matrices for high performance composites due to their excellent electrical, thermal, and high temperature mechanical properties.In particular, photosensitive polyimide can be advantageously utilized in microelectronic fabrication since it can eliminate the need for photoresists in the complicated microelectronic fabrication processes. Since most of them usually show insolubility, infusibility and thus, poor processability, they are generally processed from the more soluble polyamic acid precursor form in a high boiling solvent, such as NMP. Polyamic acids(PAA) in solution, however, are unstable during storage for a long period of time since the hydrolytic cleavage reaction readily takes place. Linear alkyl esters of PAA are much more hydrolytically stable in solution than the parent PAA. At the meeting, we will present our findings on the synthesis and characterization of polyamic acid esters based upon ODA and PMDA. Thus, the effects of various dehydrating agents on the molecular weight of polyamic acid esters, and the imidization studies of polyamic acid esters as a function of alky groups in the solid state. Furthermore, our findings on the chemistry involved in the transformation occurring under UV irradiation of polyamic acid hydroxyethyl methacrylate esters will be reported, too. In order to get some further insight in to the chemistry, UV spectroscopy, IR spectroscopy, DSC, and TGA were utilized for characterization. |
