| 학회 |
한국고분자학회 |
| 학술대회 |
2012년 봄 (04/12 ~ 04/13, 대전컨벤션센터) |
| 권호 |
37권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Mechanical Properties of Flexibilizer hybridization in Biphenyl Epoxy/Phenol Novolac Resin |
| 초록 |
The hybridization of flexibilizer for using a die attach film (DAF) in PCB substrated is investigated. Biphenyl type epoxy is selected and cured with phenol type hardener. Because of the mesogen groups in biphenyl epoxy optional form the quasi-crystalline structure via π-π stacking of aromatic rings. Therefore, Cu migration is suppressed by phenol-cured biphenyl epoxy. However, phenol-cured biphenyl epoxy/flexibilizer composites are generated Cu migration. Not only can be hybridization of flexibilizer prevented Cu migration, but it also shows strong adhesive strength and mechanical properties. The mechanical properties were evaluated by UTM. Specially, CTBN and silicone oil mixed in a weight ratio of 1:1 are shown higher adhesion strength than other mixing ratios by T-peel test (ASTM D1876). Also, the accelerated Cu migration test demonstrates that the migration is able to suppress by the phenol-cured biphenyl epoxy/flexibilizer combination during more than 500 hrs. |
| 저자 |
최민우1, 서경혁1, 서흔영1, 조철호2, 윤호규1
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| 소속 |
1고려대, 2Hynix Semiconductor Inc. |
| 키워드 |
biphenyl type epoxy; Cu migration; flexibilizer; T-peel
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| E-Mail |
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