| 초록 |
Ceramic/epoxy composites have been widely used for effective thermal managements of various heat source devices such as highly integrated semiconductors, owing to their high thermal conductivity, good electrical insulation, and exellent mechanical properties. Direct ink writing(DIW) of ceramic/epoxy composites is considered a potentially useful processing technology for their complicated additive manufacturing(or "3D printing"). while it is possible to achieve the printable rheological properties for an ink-type ceramic/epoxy composite with various methods, the in-situ thermal curing of its printed structure is still challening. in this study, we show that the latter can be possible by simply adding small amounts of water to the uncured ink-type composite, which is attributed to the induced capillary attraction between the particles and the change in the curing kinetics. |
