| 학회 | 한국재료학회 |
| 학술대회 | 2012년 가을 (11/07 ~ 11/09, 라카이샌드파인 리조트) |
| 권호 | 18권 2호 |
| 발표분야 | F. 광기능/디스플레이 재료(Optical Funtional and Display Materials) |
| 제목 | Direct bonding of Cu-AlN using CuO-Cu2O powder mixture as an oxygen partial pressure equilibrator |
| 초록 | We have studied about direct bonding of Cu-AlN which is a promising material in the high heat-dissipation field. In the DBC (direct bonding of copper) process, the most important thing is the oxygen partial pressure surrounding the AlN/Cu bonding pairs so that Ar gas with some amount of oxygen gas are industrially used as a background gas atmospheres. It is very difficult to adjust the equilibrium partial pressure of oxygen in this Cu-Cu2O-Al2O3-AlN system since we do not know the exact equilibrium particall pressure of this complicated metal – ceramic solid-liquid interface. Therefore we have utilized the in-situ equilibrium developed among Cu-Cu2O-CuO in order to adjust the favorable PO2 condition at the bonding temperatures. For experiment, Cu foil and AlN substrate was used with or without oxidation. The direct bonding was executed in the presence of CuO or Cu2O powder around Cu foil/AlN substrate at 1065 ~ 1085 oC in Ar atmospheres. The interface of bonding pair was observed by optical microscopy and scanning electron microscopy. The adhesion strength was relatively better in case of using CuO powder than Cu2O powder. This increased adhesion strength was owing to the fact that CuO was deoxidized by itself to liberate oxygen which was consumed to in-situ oxidized Cu foil as following equation. 2CuO -> Cu2O + 1/2 O2 The boundary liquid phase formed was analyzed with EPMA/AES to reveal the composition and phase composition of the eutectic melt. Using of Cu foil with CuO layer after oxidation gave a worse adhesion than the non-oxidized Cu foil. It is expected that the liquid phase gave the strong wetting and better adhesion due to the thinness of the in-situ formed liquid phase. |
| 저자 | Junsung Hong1, JungHoon Lee2, Youna Oh1, Kwang Jun Cho2, Sangdon Lee1, Jaeyook Kim2, Doh-Hyung Riu1 |
| 소속 | 1Department of Materials Science & Engineering, 2Seoul National Univ. of Scicnce & Technology |
| 키워드 | direct bonding of cupper (DBC); cupper; oxidation; joining; cupper oxide |
