| 학회 |
한국화학공학회 |
| 학술대회 |
2006년 가을 (10/27 ~ 10/28, 고려대학교) |
| 권호 |
12권 2호, p.1398 |
| 발표분야 |
고분자 |
| 제목 |
Residual Stress Behavior of Mechanically Stable Polyimide Thin Films based on p-phenylene and p-oxydianiline on Si Wafer Substrate |
| 초록 |
Four different strucuture polyimide thin films based on p-phenylene diamine and p-oxydianiline were synthesized by using two different dianhydrides, PMDA and BPDA, and their residual stress behavior and mechanical properties was investigated by using Thin Film Stress Analyzer (TFSA) and nano-indentation method. The residual stress behaviors and mechanical properties were correlated to the morphological structure in polyimide films. The morphological structure of polyimide thin films was characterized by x-ray diffraction patterns and refractive indices. The PDA-based polyimide films, PMDA-PDA and BPDA-PDA, showed relatively lower residual stress higher hardness than the corresponding ODA-based polyimide films, PMDA-ODA and BPDA-ODA. The morphological structure (i.e., film orientation, packing order, crystallinity) of polyimide films is strongly dependent upon the chemical backbone structure, which may impart the residual stress behaviors and hardness/modulus in polyimide thin films. The in-plane orientation and molecular ordered phase was enhanced with increasing order BPDA-ODA ＜ PMDA-ODA ＜ BPDA-PDA ＜ PMDA-PDA. |
| 저자 |
장원봉, 이석규, 최승혁, 서민범, 신대용, 한학수
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| 소속 |
연세대 |
| 키워드 |
Residual stress; Hardness; Morphological structure; Chain mobility
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| E-Mail |
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| 원문파일 |
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