| 학회 |
한국공업화학회 |
| 학술대회 |
2006년 봄 (05/12 ~ 05/13, 전북대학교) |
| 권호 |
10권 1호 |
| 발표분야 |
접착제도료잉크 |
| 제목 |
Abating Formaldehyde Emission of Urea-Formaldehyde (UF) Resin Adhesives for Particleboard |
| 초록 |
This study was conducted to abate the formaldehyde emission (FE) of particleboard using urea-formaldehyde (UF) resin modified by adding urea solution (US), or urea-formaldehyde prepolymer (UFP) synthesized in the laboratory. As US and UFP concentration in UF resin increased, the reactivity of modified UF resins decreased. The results showed that the core UF resin of low molar ratio was more effective than the counterpart in formaldehyde scavenging of particleboard. Addition of about 20% UFP addition in the core UF resin lowered the FE of particleboard to around the E1 grade of formaldehyde emission. |
| 저자 |
박병대1, 강은창2, 박종영2
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| 소속 |
1경북대, 2국립산림과학원 |
| 키워드 |
urea-formaldehdye resin; formaldehyde emission; particleboard
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| E-Mail |
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