| 학회 |
한국공업화학회 |
| 학술대회 |
2016년 봄 (05/02 ~ 05/04, 여수 엑스포 컨벤션) |
| 권호 |
20권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Cure Behavior for Low Temperature and Fast Cure of the IT Epoxy Adhesive with Mercaptan Hardener |
| 초록 |
Epoxy adhesive is widely used in electronic apparatus, it is included in the small parts and devices. In particular, the low-heat-resistant material such as polymeric material is needed fast and low-temperature curing behavior because avoided high temperature exposure. In general, it was well known that the curing reaction at low temperature of the epoxy and mercaptan is faster than the reaction of the epoxy and amine. In this study, we are studied the curing behaviors of diglycidyl ether of bisphenol A (DGEBA) with modification of mercaptan hardener. We adopted the mercaptan with –SH functional group in order to enable low-temperature and fast curing. It was used in the two types according to the number of functional groups. The curing property was analyzed by Differential Scanning Calorimetry (DSC) and Rheometer. |
| 저자 |
나영재1, 권세진1, 강주희1, 송호준1, 이태규2, 이상국1
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| 소속 |
1한국생산기술(연), 2연세대 |
| 키워드 |
IT Epoxy adhesive; Mercaptan; Curing characteristic
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| E-Mail |
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