| 학회 |
한국공업화학회 |
| 학술대회 |
2016년 봄 (05/02 ~ 05/04, 여수 엑스포 컨벤션) |
| 권호 |
20권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Study on Hardener modified with copolymer of the IT Epoxy Adhesive for Curing Property |
| 초록 |
An Epoxy adhesive for attaching the Light emitting diodes (LEDs) and the LED lens is composed of Epoxy resin and hardener. The LED adhesive is essential to stick the light diffusion lens on the substrate for smooth and bright light of the LED. It is required different characteristics with general epoxy adhesives such as low-temperature and fast curing. In this study, Hardener with copolymer-based mercaptan silane and Long chain (octyl) silane synthesized by sol-gel condensation reaction. The thermal properties were investigated by Thermo gravimetric analyzer (TGA). Curing behaviors were evaluated by Differential Scanning Calorimetry (DSC) at dynamic and isothermal conditions. |
| 저자 |
나영재1, 권세진1, 강주희1, 송호준1, 이태규2, 이상국1
|
| 소속 |
1한국생산기술(연), 2연세대 |
| 키워드 |
Copolymer; Low temperature curing; Sol-gel; Epoxy adhesive
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| E-Mail |
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