| 학회 |
한국공업화학회 |
| 학술대회 |
2016년 가을 (10/26 ~ 10/28, 제주국제컨벤션센터(ICCJEJU)) |
| 권호 |
20권 2호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Curing behavior of Copolymer-based Hardener for IT Epoxy Adhesive |
| 초록 |
Light emitting diodes (LEDs) were utilized in various electronic devices such as opto-electronic device. The LED adhesive is essential to improve the light diffusion lens on the substrate for smooth and bright light of the LED. In particular, It is required for characterization low-temperature and fast curing. In this paper, The mercaptan oligosiloxane resins were synthesized by sol-gel condensation reaction of (3-mercaptopropyl)-trimethoxysilane (MPTMS) and trimethoxy(octyl)silane (TMOS). The thermal features were investigated by Thermogravimetric analyzer (TGA). Curing behaviors were examined by Differential Scanning Calorimetry (DSC) at dynamic and isothermal conditions. |
| 저자 |
강주희, 강호용, 나영재, 석웅철, 권세진, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
Copolymer; Curing behavior; Sol-gel; Epoxy adhesive.
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| E-Mail |
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