| 학회 |
한국재료학회 |
| 학술대회 |
2013년 봄 (05/23 ~ 05/24, 여수 엠블호텔(THE MVL)) |
| 권호 |
19권 1호 |
| 발표분야 |
B. 나노재료(Nanomaterials) |
| 제목 |
Interface Grooving of Copper-Nickel Layer with Nano-sized Thickness |
| 초록 |
Interface instability of electroplated copper-nickel layers with nano-sized thickness was studied by small angle neutron scattering (SANS) and atomic force microscopy (AFM). The average thickness of copper and nickel deposits of the layer determined by transmission electron microscopy (TEM) were about 20 nm and 30 nm, respectively. The parallel interface between copper and nickel deposits was thermally grooved by annealing 400°C for 6 hours, which changed the SANS spectra. As annealing temperature and time increased, the interface grooving behavior was enhanced. The temperature to occur the thermal grooving of the copper–nickel interface formed by electroplating was significantly lower than that of the copper-nickel interface formed by normal metallurgical process. It is related to a high residual stress of the electroplated deposits |
| 저자 |
C. H. Song1, G. H. Choi2, Se B. Oh1, Y. Choi2, E. J. Shin1, B. S. Seong2, Y. S. Han1, J. Y. Lee2, M. Kim3
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| 소속 |
1Department of Materials Science and Engineering, 2Dankook Univ., 3Hanaro |
| 키워드 |
Small angle neutron scattering; Nano-sized copper-nickel multi-layer
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| E-Mail |
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