| 학회 |
한국재료학회 |
| 학술대회 |
2011년 가을 (10/27 ~ 10/29, 신라대학교) |
| 권호 |
17권 2호 |
| 발표분야 |
B. Nanomaterials and Processing Technology(나노소재기술) |
| 제목 |
Effect of anionic polyelectrolyte on Alumina dispersions for Ru chemical mechanical polishing |
| 초록 |
Ru is used as a bottom electrode capacitor in dynamic random access memories (DRAMs) and ferroelectric random access memories (FRAMs). The surface of the Ru needs to be planarized which is usually done by chemical mechanical polishing (CMP). Ru CMP process requires chemical slurry consisting of abrasive particles and oxidizer. A slurry containing NaIO4 and alumina particles is already proposed for Ru CMP process. However, the stability of the slurry is critical in the CMP process since if the particles in the slurry get agglomerated it would leave scratches on the surface being planarized. Thus, in the present work, the stability behavior of the slurry using a suitable anionic polyelectrolyte is investigated. The parameters such as slurry pH, polyelectrolyte concentration, adsorption time and the sequence of addition of chemicals are optimized. The results show that the slurry is stable for longer time at an optimized condition. The polishing behavior of the Ru using the optimized slurry is also investigated.
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| 저자 |
R. Prasanna Venkatesh1, S. Noyel Victoria2, Tae-Young Kwon3, Jin-Goo Park1
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| 소속 |
1Dep. of Materials Engineering, 2Hanyang Univ., 3Dep. of Materials Engineering Hanyang Univ. |
| 키워드 |
Ru; CMP; anionic polyelectrolyte; slurry stability
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| E-Mail |
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