| 초록 |
The cure kinetics of biphenyl type epoxy resin composition with different micro-encapsulated latent catalyst were investigated for halogen-free epoxy molding compounds(EMC), and shelf life test of these systems were performed. YX4000H and NC3000H as the biphenyl Epoxy resin and MEH7851SS as biphenyl type hardener were used. Triphenylphosphine (TPP) micro-encapsulated with polymethyl methacrylate (EPCAT-P), polystyrene (EPCAT-PS), polyethyl acrylate (EPCAT-PE), polyamide-methyl methacrylate (EPCAT-PAM) as encapsulation type latent catalyst were used. The cure kinetics of these systems were analyzed by differential scanning calorimetry using isothermal approach, and the kinetic parameters of all systems were reported in terms of generalized kinetic equation with the diffusion effects. |
