| 학회 |
한국공업화학회 |
| 학술대회 |
2019년 봄 (05/01 ~ 05/03, 부산 벡스코(BEXCO)) |
| 권호 |
23권 1호 |
| 발표분야 |
무기재료_포스터 |
| 제목 |
Ultralow contact resistivity for high power density of skutterudite-based thermoelectric modules through Fe-Ni metallization layer |
| 초록 |
Because thermoelectric devices generally consist of numerous pairs of p- and n-type TE materials in a rectangular leg shape, most thermoelectric modules suffer from significant power loss resulted from the high electrical and thermal resistivity at the interface between the thermoelectric leg and the metallic contacts. Here we report a Fe−Ni metallization layer successfully binding skutterudite materials and metallic electrodes with minimal energy loss. This layer also suppresses chemical reactions and interdiffusion to make a secondary phase occurring at that interface. As a result, our thermoelectric module shows ultralow internal resistance of 42 mΩ and electrical contact resistivity of 2.2−2.5 μΩ cm2, which contributes to the highest reported power density of ∼2.1 W cm−2 of the device for a temperature difference of 570 K to date. |
| 저자 |
차준일, 정인
|
| 소속 |
서울대 |
| 키워드 |
Thermoelectric; module; contact resistivity
|
| E-Mail |
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