| 학회 |
한국공업화학회 |
| 학술대회 |
2016년 가을 (10/26 ~ 10/28, 제주국제컨벤션센터(ICCJEJU)) |
| 권호 |
20권 2호 |
| 발표분야 |
(디스플레이) 디스플레이용 고기능성 소재 기술개발 현황 및 전략 |
| 제목 |
Henkel Technology and Product Development for OLED Encapsulation and Assembly |
| 초록 |
AMOLED encapsulation and module assembly post new challenging requirements for material suppliers. For flexible and foldable AMOLED display such challenges became even more stringent.. This presentation will highlight where AMOLED display is calling for high-performing materials ranging from barrier films and PSA for encapsulation, to sealant, adhesives, encapsulants and printable conductive inks for module assemblies. This presentation will also introduce Henkel’s technology development and product offering in a number of AMOLED display applications. |
| 저자 |
Renyi Wang |
| 소속 |
Henkel Adhesives Electronics |
| 키워드 |
OLED; Sealant; Adhesive
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| E-Mail |
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