| 초록 |
For flexible OLED, encapsulation technology is required to protect the device from moisture and oxygen. If traditional edge sealing method is used to the device, barrier substrate can give non-uniform stress to OLED that damages the device. Therefore, face sealing method is needed for flexible OLED. PIB(Polyisobutylene) having low gas permeation and transparent property is one of the candidates for face sealant. However, it has some problems in handling and reliability at high temperature and humidity conditions. In this study, we tried to modify the PIB by crosslinking and copolymerization with several monomers to improve its elasticity and adhesive property. The prepared face sealant was applied to barrier film deposited using PEALD, which assured the flexible OLED device free from moisture and oxygen. |
