| 초록 |
Polyimide resins are well known to have high thermal stability, mechanical property and chemical resistance. Therefore They are widely used as film for high performance. Recently, transparent and flexible polyimides have been reported by incorporated of bulky or low dielectric constant structures in main polymer chain. But these polyimide films are major drawback, such as high coefficient of thermal expansion (CTE) and low thermal stability. However, in order to overcome drawback of the polyimides, polyimide composite with epoxy have been considered as a successful method. Polyimides were prepared by themal imidazation reaction of 2,2'-Bis-(3,4-Dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) and 3,3'-Dihydroxy-4,4'-diamino-biphenyl (HAB) in 1-Methyl-2-pyrrolidinone (NMP). Then PI/Epoxy composites (PEIs) were prepared by blending of 6FDA-HAB with different composition of DGEBA. |
