| 학회 |
한국고분자학회 |
| 학술대회 |
2020년 가을 (10/05 ~ 10/08, 부산컨벤션센터(BEXCO)) |
| 권호 |
45권 1호 |
| 발표분야 |
고분자합성 |
| 제목 |
Preparation and properties of protective material for electronic device based on crosslinked poly(imide-siloxane) |
| 초록 |
Power semiconductor has become important device for power system applications such as high voltage direct current transmission. It is known that materials and protecting technologies play more important roles in the field of power electronic protecting. Electronic device uses silicone as the base protective material, limiting junction operating temperature below 150℃. To solve the limitation, more and more attention has to be paid to protecting technologies and materials. Poly(imide-siloxane) has excellent properties such as high thermal, insulation and mechanical properties. In this study, we prepared crosslinked poly(imide-siloxanes) through hydrosilylation reaction and studied their properties. The resultant crosslinked poly(imide-siloxane) showed high decomposition temperature (T10) over 450℃ and low thermal conductivity of 0.11. These exceptional characteristics make crosslinked poly(imide-siloxane) suitable for protective materials of electronic device. |
| 저자 |
박형주, 최주영, 진승원, 이승현, 최윤제, 김담비, 정찬문
|
| 소속 |
연세대 |
| 키워드 |
Poly(imide-siloxane); Hydrosilylation; Crosslinked poly(imide-siloxane)
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| E-Mail |
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