| 초록 |
PAI has high thermal, chemical, mechanical and electrical stability. Thus, it is widely used for insulation and heat-resistant resin, such as magnet wires. However, It is required higher electrical and thermal stability for latest electronics and high efficiency industry. In this study, we have fabricated silane treated colloidal silica-Polyamideimide nanohybrid materials by using sol-gel process. It is not in accordance with Polyamideimide-Organometalalkoxide nanohybrids. By using colloidal silica, It is easier to control particle size and get uniformaty particle distribution. Thermal characterization is measured by TGA, DSC and TMA. Morphology is identified by using FE-SEM. Electrical properties, such as dielectric constant is measured by LCR-meter |
