| 학회 |
한국고분자학회 |
| 학술대회 |
2009년 봄 (04/09 ~ 04/10, 대전컨벤션센터) |
| 권호 |
34권 1호 |
| 발표분야 |
고분자 합성 |
| 제목 |
Synthesis and Characterization of Polyimide/silica Hybrid Films Derived from Silane Oligomer Containing Epoxy Group |
| 초록 |
Aromatic polyimides are widely used for the substrate of the microelectronic packaging applications such as flexible printed circuit (FPC) and chip on film (COF). In these applications, polyimides are employed as flexible substrates for the metallization of copper. However, polyimide films have much higher coefficient of thermal expansion (CTE) values in the film plane direction than those of copper metal layer. Also, the satisfactory adhesion strength of copper metals to polyimide films could not be obtained in these processes. In this study, we synthesized polyimides/silica hybrid films using silane oligomers containing epoxy group for a higher thermal property and a better chemical bonding of hybrid film with copper metal layer. |
| 저자 |
이준혁1, 박윤준1, 최종호1, 남상용2, 홍영택1
|
| 소속 |
1한국화학(연), 2경상대 |
| 키워드 |
polyimide; hybrid; adhesion
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| E-Mail |
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