| 학회 | 한국재료학회 |
| 학술대회 | 2019년 가을 (10/30 ~ 11/01, 삼척 쏠비치 호텔&리조트) |
| 권호 | 25권 2호 |
| 발표분야 | E. 환경/센서 재료 분과 |
| 제목 | The Electrical Insulation Characteristics of MEMS Pressure Sensor using Glass Paste For Bonding Materials |
| 초록 | Silicon MEMS type pressure sensor modules used in these applications are mainly determined by the electrical insulation characteristics of MEMS element and bonding structures. Therefore, in this study, the withstand voltage characteristics of the bonding structure using glass paste between the MEMS element and the diaphragm are analyzed according to the thickness, structure, and distribution of the internal pores. It was found that the thicker the glass bonding layer and the larger the margin area covering the MEMS element, the better the withstand voltage characteristics. It was also known that the withstand voltage characteristics were greatly influenced by the pore distribution (size and density) in the bonding layer. Therefore, it was found that the thickness and area of the glass bonding layer should be optimized and the internal porosity should be minimized to obtain excellent withstand voltage characteristics in the pressure sensor bonding the MEMS element. |
| 저자 | 이곤재 |
| 소속 | (주)만도 |
| 키워드 | insulation; glass; bonding; mems |
