| 학회 |
한국재료학회 |
| 학술대회 |
2019년 가을 (10/30 ~ 11/01, 삼척 쏠비치 호텔&리조트) |
| 권호 |
25권 2호 |
| 발표분야 |
D. 구조 재료 분과 |
| 제목 |
Study of elevated temperature phase stability of core-shell structured CoCrFeNiTi0.5-TiN high entropy composite |
| 초록 |
High entropy alloys are still in early stage of development. Given the complexity of the compositional space they attain, the current level of understanding of these alloys is quite low. Previously we have demonstrated the in situ synthesis of TiN coated CoCrFeNiTi0.5 core-shell powder and bulk alloy. In this study, we explore the stability of CoCrFeNiTi0.5-TiN core-shell microstructure at elevated temperatures. The fully TiN coated core-shell powder was obtained by heat treatment of mechanically alloyed single phase CoCrFeNiTi0.5 powder under partial N2 atmosphere. The temperature and PN2/PAr values for heat treatment were selected to be 900oC and 0.10 respectively. Furthermore, the core-shell powder was sintered using spark plasma sintering to achieve core-shell structured bulk. Afterwards, in order to evaluate the high temperature stability of the achieved microstructure, the sintered samples were annealed in a vacuum at temperatures of 1100, 1200, 1300, 1400 and 1500oC. The SEM, EDS and XRD analysis were used to evaluate the microstructure and phase development. It was observed that the microstructure of the sintered sample remained stable throughout due to high temperature stability of TiN phase. In addition, with increasing temperature the TiN precipitates increased inside the core of the particles hindering grain growth even at high temperatures. Furthermore hardness testing of the sample revealed that the heat treated sample showed no sign of decrease in hardness. This study confirmed the stable nature of the novel microstructure achieved.
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| 저자 |
Muhammad Aneeq Haq1, Eom Nu Si A2, Noh Su1, Hansaem Lee1, Bum Sung Kim1
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| 소속 |
1Korea Institute of Industrial Technology, 2Univ. of Science and Technology |
| 키워드 |
SPS; High Entropy; Powder Annealing; Core-Shell; Intermetallics
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| E-Mail |
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