| 초록 |
Recently, research on heat dissipating materials is necessary for efficient thermal management of electronic devices. Carbon fiber is spotlighted as a new high-functional heat dissipation material because of its high thermal conductivity, excellent mechanical properties, and lightness. However, carbon fiber is expensive because the manufacturing process is complicated and requires a lot of energy. Therefore, it is expected that the process cost can be reduced through research on heat dissipation materials using low-cost recycled carbon fiber. In this study, using several lengths recycled carbon fibers, thermal conductivity of samples by several amounts and lengths of carbon fiber in epoxy were obtained. The thermal conductivity of the test samples was obtained using the Hot-disk equipment. The heat dissipation characteristics of adhesives were also investigated. |
