| 초록 |
Recently, as smart devices and electronic products have become lighter, more flexible, and multifunctional, development of heat dissipation materials for device performance and lifespan management is required. Most heat dissipating materials are made by mixing epoxy with metal or ceramic filler. However, for high thermal conductivity, a large amount of ceramic or metal filler is included, which can reduce mechanical strength. Therefore, there is a need for research on thermally conductive adhesives having high heat dissipation properties while enhancing mechanical properties. In this study, some thermally conductive adhesives were prepared by mixing graphite and milled carbon fibers in epoxy resin. The adhesives obtained by adding different amounts of graphite and milled carbon fibers were applied to the surface-treated Al substrate and then cured. Mechanical properties of T-peel strength and overlap shear strength were measured using the prepared samples. |
