화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2014년 가을 (10/06 ~ 10/08, 제주 ICC)
권호 39권 2호
발표분야 고분자가공/복합재료-자가치유 고분자와 복합소재
제목 Optimized lithography process and preparation of Sub 20 -um Conductive Silver Pattern
초록 In recent years, materials for conductive printing have been attracted in industry of printed electronics such as display, mobile phone and solar cell. Silver paste has been used for fabrication of bezel pattern in touch panel due to high conductivity of silver (6.29*105 S/m). Photosensitive silver paste was fabricated by mixing micro-sized silver powders, polymeric binders, acrylic monomers, and photoinitiators in organic medium. Conductive silver line pattern with the width of sub 20 um was successfully prepared by optimized photolithography process using front or behind exposure. We were able to get a strong adhesion and high electrical conductivity up to 2.8×10-4 cm in the presence of triethylamine as an activating agent.
저자 김석준1, 박영호1, 이원진2, 인인식1
소속 1한국교통대, 2코스모신소재
키워드 Silver pattern; bezel Pattern; Silver paste
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