| 초록 |
Liquid metal (LM) is considered the most suitable material for soft electronics due to its high conductivity, superior deformation and elasticity comparable to metal. However, it was difficult to create a film with chemical and mechanical stability, and the actual application was limited because traditional cleanroom-based processes could not form multilayer (from microns to mm) and multilayer patterns. This study suggests how to create a particle-assembled LM film uniformly over a large area through a solution shearing of LM particulate ink with polymer electrolytes attached. Ink has been formulated to significantly stabilize the LM particles in the solution and to help self-assembling with thin films during the solution shear. In particular, the photolithography lift-off process allows patterning of wafer scale, multilayer, and high-resolution features (~10 μm) of varying thicknesses, providing a wide variety of processes for manufacturing different soft electronics. |
