| 초록 |
Dry film resist (DFR) is a critical material which is usually used to make patterns for PCB fabrication. The DFR contains binder polymer, photo-curing monomer, and additives. The DFR requires good adhesion with the substrate and high resolution. The resist adhesion was greatly affected by the binder polymer among DFR components. We synthesized novel binder polymers having both photoreactive methacrylate moiety and thermally cleavable tertiary ester moiety. The methacrylate moiety was reacted with photocuring monomers upon irradiation. The reaction increases the cross-link density and enhances the adhesion. And the tertiary ester moiety was degradable by thermal treatment. The ester was converted to the carboxylic acid and became soluble in a basic stripper. Therefore, fine patterns of DFR were obtained without pattern swelling and adhesion failure. |
