| 초록 |
Markets requires to have a high density integration in a electronic devices. But along with high integration of device, a lot of heat is generated. Such heat in the device degrades the performance of the device. So, many techniques for controlling heat have been developed. One of them which is commonly used is sheet as heat-dissipating sheet. The sheet consists of resin act as matrix and filler having thermal conductivity. The metal is widely used as a filler because it is highly thermal conductivity and electrical conductivity due to free electron. The filler of metal with electrical conductivity can result in malfunctioning of the electronics. Therefore, we coated alumina layer as role of insulation with the aluminum powder having a high thermal conductivity (237W/m·K) to formed a complex filler of insulation. Then, after making a sheet having the filler, thermal conductivity and dielectric properties were measured. |
