| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 가을 (10/13 ~ 10/14, 제주 ICC) |
| 권호 | 30권 2호 |
| 발표분야 | 고분자 가공/블렌드 |
| 제목 | Micro patterning of thermoset materials by thermal imprint technology |
| 초록 | Imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we studied a feasibility of the thermal imprinting on thermoset materials. To make 3-D imprinted patterns, we controlled the curing degree (%) and curing rate of thermoset materials. These were investigated with rheometer and infrared spectroscopy. The patterns of thermoset materials were measured by SEM (scanning electron microscope) and confocal microscope. Figure 1. Rheometer data of thermoset materials depending on curing rate |
| 저자 | 조재춘, 이춘근, 나승현, 박미희 |
| 소속 | (주)삼성전기 중앙(연) |
| 키워드 | Epoxy resin; curing agent; curing velocity; Imprinting |
