| 학회 |
한국고분자학회 |
| 학술대회 |
2012년 봄 (04/12 ~ 04/13, 대전컨벤션센터) |
| 권호 |
37권 1호 |
| 발표분야 |
고분자구조 및 물성 |
| 제목 |
Effect of Hardener and Curing condition on Thermal Conductivity of Biphenyl Type Epoxy |
| 초록 |
Heat generation in electronic devices shorten the lifetime. So, thermal radiation is important. Biphenyl type epoxy was selected to generate quasi-crystalline structure and cured with phenol and aromatic amine type hardener. Adding surfactant and changing the curing condition are effective on high thermal conductivity of the epoxy resin by inducing π-π interaction among mesogenic group such as aromatic rings. Curing condition and glass transition temperature was measured by different scanning calorimetry(DSC). Thermal conductivity of the epoxy resin was calculated by ASTM D5470. The crystallinity of the epoxy resin was observed by field emission-transmission electron microscopy(FE-TEM) and X-ray diffraction(XRD). |
| 저자 |
서경혁, 최민우, 한상학, 윤호규
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| 소속 |
고려대 |
| 키워드 |
Epoxy resin; thermal conductivity
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| E-Mail |
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