| 초록 |
5G mobile communication is essential for developing advanced electronic device such as internet of things (IoTs). To realize 5G technology, high performance copper clad laminates (HPCCLs) consisting of dielectric with low dielectric constant (Dk) and dissipation factor (Df) at high frequency, have been considered as a key factor of printed circuit board (PCB) to reduce delay and error rate of signal. Here, we present a low Dk/Df siloxane hybrid polymer for HPCCLs, using phenyl-siloxane hybrid (PSH) resin. The cured PSH showed Dk/Df of 2.86/0.002 at the frequency of 10 GHz. Furthermore, the PSH showed low water absorption of 0.04% which leads high dielectric stability. In addition, we fabricated prepreg by impregnating PSH resin into glass-fabric. The cured prepreg showed high thermal degradation temperature, and low coefficient of thermal expansion. Finally, we fabricated HPCCLs by attaching rolled Cu foil of low surface profile to the prepreg, followed by curing process. |
