화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2009년 가을 (10/08 ~ 10/09, 광주과학기술원 오룡관)
권호 34권 2호
발표분야 고분자 가공/복합재료
제목 Effect of thermally conductive fillers on the thermal diffusivity and adhesion properties of UV cured adhesives
초록 Acrylic pre-polymer was partially polymerized and the pre-polymer was cured with trimethylolpropane triacrylate (TMPTA) by UV irradiation. The effects of UV dose, acrylic acid contents, multi-functional monomer contents on the thermal diffusivity and adhesion properties of PSA were investigated. Thermal diffusivity increased with increasing UV dose up to 3000 mJ/㎠ and further increase was observed with the increase of TMPTA content. With increasing the UV dose, the thermal diffusivity was increased from 7.68 × 10-4 ㎠/s to 12.9 × 10-4 ㎠/s by introducing UV dose and TMPTA. An increase in the peel strength was also observed with the increase of UV dose and acrylic acid content. In acrylic adhesives with thermally conductive filler, the effect of filler (Carbon fiber or Al2O3) particles such as, their shape, contents and thermal conductivity and adhesion properties of thermal conductive adhesives were investigated.
저자 박꽃피네1, 김혜민1, 이성구2, 김성룡1
소속 1충주대, 2한국화학(연)
키워드 열전도성; 점착제; structure formation; IPN; 점착물성; carbon fiber; UV경화
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