화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2019년 가을 (10/09 ~ 10/11, 제주컨벤션센터)
권호 44권 2호
발표분야 고분자가공/복합재료
제목 The moisture barrier film using thermal epoxy resin and Atomic Layer Deposition(ALD)
초록 The organic luminescent material easily loses its luminescence once it is exposed to moisture, and the highly reactive cathode with low work function will be easily corroded by moisture and oxygen. To solve this problem, We demonstrate flexible moisture barrier film encapsulation for organic electronics using low temperatures process method. To realize the flexible barrier, the best practice is to make the barrier as multilayer structure. Low temperatures process applied the atomic layer deposition(ALD) method and epoxy coating method to deposit barrier films. Organic-inorganic layers work as moisture barrier and very thin thickness provide the flexibility and planarization. The moisture permeation characteristics of the optimized Al2O3/ 4-component adhesive multilayer films were finally measured using Ca-test's WVTR measuring instrument and WVTR values lower than the detection limit of the measuring device were obtained. Abstract
저자 김성희, 이준영
소속 성균관대
키워드 ALD; thin film
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