| 학회 |
한국재료학회 |
| 학술대회 |
2007년 봄 (05/10 ~ 05/11, 무주리조트) |
| 권호 |
13권 1호 |
| 발표분야 |
제12회 신소재 심포지엄 |
| 제목 |
An overview of high performance 3D-WLP |
| 초록 |
3D technologies offer remarkable opportunities compared to conventional 2D scaling. The most prominent advantage among others is its performance. 3D technologies enhance a device performance with improving its bandwidth, RC Delay and 3D geometrical routing and placement. In particular as the maturity of 3D technology progresses with the integration of divergent process flows, it can extensively improve performance and new applications will become more viable with the simplified packaging requirements. 3D-WLP(wafer level packaging) is one of many options of 3D technologies and can be categorized as a system-in-a-package(SIP) solution and it is of great interest to many researchers. The processing and material challenges and opportunities of 3D -WLP will be reviewed. |
| 저자 |
김은경 |
| 소속 |
서울산업대 |
| 키워드 |
3D technology; Wafer stacking; WLP
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| E-Mail |
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