| 학회 |
한국고분자학회 |
| 학술대회 |
2017년 가을 (10/11 ~ 10/13, 제주컨벤션센터) |
| 권호 |
42권 2호 |
| 발표분야 |
3D 프린팅 소재기술(영어발표) |
| 제목 |
3D Printing Materials for Electronic Applications |
| 초록 |
3D printing has been studied in recent years because it has the potential to reduce the processing cost and size with an additive manufacturing. The advantages of the 3D printing in the field of electronics are that it has the ability to truly integrate electronics with objects, and the fact that 3D printing allows for distributed manufacturing. But, 3D printing for electrical devices has not moved as quickly from concept into practical use in either industry or prototype labs. The main limitations for the 3D printed electronics relate to electronic materials availability, reliability of the final product, repeatability, speed, and yield. Up to now, various substances including silver pastes, silver based gels, and graphene have been introduced for the 3D printing of electronics. In this study, we developed new composite metals having a high electric conductivity of approximately 10 μohm-cm and various printing temperatures and viscosities. These materials were practically composed of the eutectic alloys and metal particles and the usefulness of them were verified by manufacturing 3D printed electronic products. |
| 저자 |
Yong Suk Yang1, Hyun Woo Dang1, Bonjin Koo1, Kyu-Sung Lee1, Ji-Young Oh1, Kyung Hyun Kim1, In-Kyu You1, Howard Shin2, Chang Woo Lee3
|
| 소속 |
1Electronics and Telecommunications Research Institute, 2Daelim Chemical, 3Korea Institute of Machinery and Materials |
| 키워드 |
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| E-Mail |
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