| 초록 |
As an alternative to traditional life testing, degradation tests can be effective in assessing product reliability when measurements of degradation leading to failure can be observed. This study presents a highly accelerated degradation testing for bare printed wiring boards (PWBs), especially for bare Ball Grid Arrays (BGAs). The highly accelerated degradation model for temperature is based on Arrehenius-lifetime relationship. The resistivity between highly accelerated degradation test method and normal reliability test method will be compared as the result with AMI, the ion migration tester. The highly accelerated degradation test for PWBs is observed as an efficient method to warrantee product reliability to customers, as well as a tool to save the testing time and costs. |
