| 학회 |
한국공업화학회 |
| 학술대회 |
2020년 가을 (10/28 ~ 10/30, 광주 김대중컨벤션센터(Kimdaejung Convention Center)) |
| 권호 |
24권 1호 |
| 발표분야 |
포스터-도료·코팅 |
| 제목 |
UV- and thermal-curing behaviors of dual-curable adhesives using divinyl sulfone |
| 초록 |
The dual curable adhesive was prepared using a sequential dual curing system based on the thiol-acrylate-epoxy formulation. The curing proceeds the UV-curing of thiol-acrylate and the thermal-curing of thiol-epoxy which requires a photo-initiator and a catalyst, respectively. The presence of sulfone in the thiol-acrylate reaction shows a high reaction selectivity and reaction rate. Thiol-acrylate-epoxy resin was synthesized using thiol monomer with four functionality, diacrylate monomer, and bisphenol A diglycidyl ether. The chemical structure of dual curable adhesive was characterized using a fourier transform infrared spectrophotometer. Thermal stability of dual curable ones was analyzed by thermogravimetric analysis. The adhesion strength and peel strength of dual curable ones were compared with using the universal testing machine. |
| 저자 |
임승호1, 김하은1, 황태성1, 김정수1, 장영욱2, 김동현1
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| 소속 |
1한국생산기술(연), 2한양대 |
| 키워드 |
Dual cure; Adhesive; Thiol; Acrylate; Epoxy; Sulfone
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| E-Mail |
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