| 학회 | 한국공업화학회 |
| 학술대회 | 2022년 봄 (05/11 ~ 05/13, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 | 26권 1호 |
| 발표분야 | 포스터-고분자 |
| 제목 | Preparation of Flexible Sandwich-Structured Poly(imide-siloxane) (PIS)/EGaIn MC/PIS Films with Electromagnetic Interference (EMI)Shielding Effectiveness |
| 초록 | Recently, due to the developments ofwearable devices and high-power electronic devices the study of materials withelectromagnetic interference (EMI) become more important. EGaIn has highperformance of EMI shielding because it has high electronic conductivity. Polyimide(PI) has good properties such as chemical resistance, electric insulation, andheat resistance. In this study, we prepared EGaIn microcapsule (EGaIn MC), and PI films from 2,2'-bis(trifluoromethyl)benzidine (TFMB), polydimethylsiloxane(PDMS), and 4,4′-hexafluoroisopropylidene)diphthalic anhydride (6FDA). PIS/EGaIn MC/PIS sandwich-structured films wereprepared and their properties were studied including EMI shielding effect,flexibility, Thermal diffusion, and conductivity. |
| 저자 | 김현우, 최윤제, 윤강훈, 고주희, 정찬문 |
| 소속 | 연세대 |
| 키워드 | EMI Shielding; Polyimide; liquid metal; microcapsule |
