초록 |
We have recently introduced a brand new concept to control the BCP orientation using brushless organosilicate (OS) substrates, whose surface energy can be finely tuned with thermal treatment. In the brushless case, the BCP chains do not penetrate into the underlying hard OS substrates, thereby, the BCP chains at the interface have no entangled structure with fairly weak adhesion of a BCP film against the substrate. Owing to such a weak adhesion of a BCP film against the OS substrate, the perpendicularly oriented BCP film on a neutral OS substrate could be easily peeled off. The OS substrate after the peel-off of a BCP film could regenerate the perpendicularly oriented BCP films since the surface energy of the OS substrate remains intact. This unique property of OS substrates allows us to produce multiple replicas of BCP thin films from a single OS substrate. |