| 초록 |
Perfluorocarbon etch gas takes up a portion of 81% in total greenhouse gas (GHG) emissions from US semiconductor fabs (2016, CO2 equivalent). For example, the famous etchants in the Si wafer process, CF4 and C2F6, account for 50% of GHG emissions in the global semiconductor industry. As a global leader in ESG initiatives, Air Liquide pioneered to develop the next generation etch gas with both superior etch performance and lower global warming potential (GWP) by leveraging its state-of-art molecule design technology. By turning knobs of 1) adding heteroelement (X), 2) adjusting C, H, F, X ratio, 3) changing chemical bond, Air Liquide has successfully developed the environment-friendly high performance etch gas products, so called as enScribe(trademark). Air Liquide's enScribe products outperform in hard mask selectivity, etch rate, and etch profile while delivering about 10000 times less GWP than conventional one. enScribe products are now being actively evaluated by several leading semiconductor manufacturers in the US, Korea, and Japan. |
