| 초록 |
Polyimides (PIs) had been widely used as protective overcoats and dielectric layer for semiconductor devices because of their good properties, such as low dissipation factors and excellent thermal and mechanical behaviors. In this work, we investigated the effect of atmospheric-pressure plasma treatment on the friction and wear properties of polyimide by varying the treatment time in atmospheric-pressure plasma system. The measurements of surface roughness, contact angle, and chemical binding states of the PI film surfaces treated by CHF3 plasma were carried out by atomic force microscopy (AFM), contact anglemeter, and X-ray photoelectron spectroscopy (XPS). Also the friction and wear properties were measured using friction & wear tests. From the above measurements, it was found that the improved of friction and wear properties were obtained at 45 times. It is primarily attributed to increase in surface roughness as well as chemical interaction. |
