| 학회 |
한국재료학회 |
| 학술대회 |
2017년 봄 (05/17 ~ 05/19, 목포 현대호텔) |
| 권호 |
23권 1호 |
| 발표분야 |
G. 나노/박막 재료 분과 |
| 제목 |
3D-printable, highly conductive hybrid composites employing chemically-reinforced, complex dimensional fillers and thermoplastic triblock copolymers |
| 초록 |
Use of 3-dimensional (3D) printable conductive materials have gained significant attention for various applications because of their ability to form unconventional geometrical architectures that cannot be realized with traditional 2-dimensional printing techniques. To resolve the major requisites in printed electrodes for practical applications (including high conductivity, 3D printability, excellent adhesion, and low-temperature processability), we have designed a chemically-reinforced multi-dimensional filler system comprising amine-functionalized carbon nanotubes, carboxyl-terminated silver nanoparticles, and Ag flakes, with the incorporation of a thermoplastic polystyrene-polyisoprene-polystyrene (SIS) triblock copolymer. It is demonstrated that both high conductivity, 22,939 S/cm, and low-temperature processability, below 80 oC, are achievable with the introduction of chemically anchored carbon-to-metal hybrids and suggested that the highly viscous composite fluids employing the characteristic thermoplastic polymer is readily available for fabricating various unconventional electrode structures by a simple dispensing technique. The practical applicability of 3D-printable highly conductive composite paste is confirmed with the successful fabrication of wireless power transmission modules on substrates with extremely uneven surface morphologies. |
| 저자 |
Yejin Jo1, Ju Young Kim1, So-Yun Kim2, Yeong-Hui Seo3, Kwang-Suk Jang4, Su Yeon Lee1, Sungmook Jung1, Beyong-Hwan Ryu1, Hyun-Suk Kim5, Jang-Ung Park2, Sunho Jeong1, Youngmin Choi1
|
| 소속 |
1한국화학(연), 2UNIST, 3Univ. of Illinois, 4한경대, 5충남대 |
| 키워드 |
3D; three dimensional; conductive; hybrid; composit; print; circuit; origami; percolative
|
| E-Mail |
|
