| 초록 |
Polymer composites are widely used as thermally conductive adhesives (TCAs) for heat dissipation in electronic devices, owing to their high thermal conductivity and excellent electrical insulation. However, thermal curing processes of commercial TCAs require long curing times and high temperatures, limiting their use in sensitive electronic devices. Moreover, high concentration of thermally conductive filler in polymer composites results in low mechanical and thermal performance due to their aggregation. Herein, we developed photocurable thermally conductive polymer composites consisting of catechol-incorporated copolymers and hexagonal boron nitride (h-BN) as thermally conductive filler. The photocuring process significantly reduced curing time to a few minutes at ambient temperature. The incorporation of catechol group improved interfacial interaction, resulting in high mechanical property. This study provides an alternative method to thermal curing for high performance adhesives. |
