| 학회 | 한국공업화학회 |
| 학술대회 | 2016년 봄 (05/02 ~ 05/04, 여수 엑스포 컨벤션) |
| 권호 | 20권 1호 |
| 발표분야 | 나노_포스터 |
| 제목 | Air sinter-able Cu electrode fabrication by self-reducible Cu ion complex ink and polyol solvent |
| 초록 | Solution processed Cu electrode fabrication has researched for advanced electronics but the conventional Cu ink has critical weakness of rapid oxidation. Breaking the limitation of conventional Cu ink, such as vacuum sintering, needs for reducing gas (H2), Shin et al, succeeded in demonstrating N2 gas sintering by self-reducible Cu ion complex ink (sCu-ink)[1] However, air sinter-able Cu electrode fabrication has not been clearly proposed. Now, we tried to verify the air sintered Cu electrode fabrication using sCu-ink and polyol solvent addition. As a result, the air sintered Cu ink shows excellent reduced Cu film and the low resistivity value (17 μΩ • cm, 350 oC). We believe that the air sintered Cu film have a good potential for practical devices. [1] Shin et al., ACS applied materials & interfaces, 2014, 6, 3312. |
| 저자 | 조상훈, 김연상 |
| 소속 | 서울대 |
| 키워드 | Cu ink; Cu electrode; air sintering; printing materials |
