| 학회 | 한국공업화학회 |
| 학술대회 | 2017년 봄 (05/10 ~ 05/12, 광주 김대중컨벤센센터(Kimdaejung Convention Center)) |
| 권호 | 21권 1호 |
| 발표분야 | 정밀화학 |
| 제목 | 새로운 평탄제의 합성과 구리전해도금에서 그 구조에 따른 영향 분석 |
| 초록 | A leveler, one of the organic additives for Cu electrodeposition, is a key element for defect-free filling. The leveler assists bottom-up filling of Cu in via by its distinct characteristics so called convection-dependent adsorption. Although several levelers have been reported, their structure and property relationship has not been studied much. In this study, we synthesized four levelers having different structures including a TEG-based leveler that we had previously synthesized before. The electrochemical properties of the levelers were analyzed and turned out to be convection-dependent, however, the magnitude of suppression was clearly different. The gap-filling results of TSV-like trenches were also contained. |
| 저자 | 이윤재, 이병일, 김남태, 이명현, 김재정, 김영규 |
| 소속 | 서울대 |
| 키워드 | 평탄제; 구리전해도금; 실리콘관통전극; 구조활성관계; 교반의존흡착 |
