| 학회 |
한국고분자학회 |
| 학술대회 |
2002년 가을 (10/11 ~ 10/12, 군산대학교) |
| 권호 |
27권 2호, p.52 |
| 발표분야 |
복합재료 |
| 제목 |
Microstructure and Thermal Properties of Low Dielectric Polyimide/Poly(silsesquioxane) Hybrid Composite Films |
| 초록 |
Polyimide/poly(silsesquioxane) (PI/PSSQ) organic-inorganic hybrid composites were prepared from BPDA-ODA polyamic acid and triethoxyvinylsilane (SSQ) via sol-gel process. The hybrid films were prepared through imidization at different temperatures. The presence of the PSSQ showed a remarkable effect on the properties and structure of the polyimide based hybrid films. Co-continuous morphologies could be produced with the use of PSSQ. Their properties were evaluated. The thermal stability and Tg of hybrid composites were found to be increased by incorporting of PSSQ and TEOS. The PSSQ domains of uniform size are fairly well dispersed in the hybrid composites films. The microstructure and interfacial interaction of the hybrid composites were investigated by scanning electron microscope (SEM) and atomic force microscope (AFM). The dielectric constant of the hybrid composites decreased after introducing PSSQ up to a certain contents, showed a minimum then found to be increased. The dielectric constant value of the hybrid composites ranged from 2.59 to 3.78. |
| 저자 |
Mohammad Abdul Wahab, 조원제, 하창식
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| 소속 |
부산대 고분자공학과 |
| 키워드 |
Hybrid composite; Thermal properties
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| E-Mail |
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